MIL-STD-790G
w/ CHANGE 1
2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
3. DEFINITIONS
3.1 Assembly plant. A plant established by a manufacturer or operated by a distributor authorized by the manufacturer to perform specified functions pertaining to the manufacturer's identified qualified products in accordance with specified assembly procedures, test methods, processes, controls, and storage, handling, and packaging techniques.
3.2 Burn-in (pre-conditioning). Process of subjecting components to conditions (temperature extreme, power input extremes, etc) with the intent to either stabilize performance or significantly reduce latent defects.
3.3 Calibration. A comparison result between a measuring device and a known standard.
3.4 Clean rooms. A clean room has a controlled level of contamination that is specified by the number of particles per cubic meter at a specified particle size.
3.5 Corrective action. A documented design, process, procedure, or materials change implemented and validated to correct the cause of failure or design deficiency.
3.6 Criticality. A relative measure of the consequence of a failure mode and its frequency of occurrence.
3.7 Defect analysis. The process of examining technical or management (nontechnical) data, manufacturing techniques, processes, or materials to determine the cause of variations of electrical, mechanical, optical, or physical characteristics outside the established limitations.
3.8 Degradation. A gradual impairment and its inability to perform.
3.9 Demonstrated. That which has been measured by the use of objective evidence gathered under specified conditions.
3.10 Electrical, electronic, and fiber optic parts. Basic circuit elements which cannot be disassembled and still perform their intended function, such as capacitors, connectors, filters, resistors, switches, relays, transformers, crystals, electron tubes, semiconductors, and fiber optic devices.
3.11 Environmental. The aggregate of all external and internal conditions (such as temperature, humidity, radiation, magnetic and electric fields, and shock vibration) either natural or
man-made, or self-induced that influences the form, performance, reliability or survival of an item.
3.12 Established reliability. A quantitative maximum failure rate demonstrated under controlled test conditions specified in a specification and usually expressed as percent failures for each thousand hours or cycles of test.
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