MIL-STD-1285 Marking Of Electrical And Electronic PartsThis standard establishes requirements for the physical marking of electrical and electronic parts. This standard should be implemented by incorporating suitable requirements directly in acquisition documents.

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MIL-STD-1285D

w/ CHANGE 1

APPENDIX N

* N.3.1.3 Circuit card, electrical, and electronic assemblies. Each circuit card assembly, electrical assembly, or electronic assembly (hereafter called assembly) shall be marked in accordance with the assembly drawing or printed board master drawing. As a minimum, traceability marking shall include the assembly part number, the assembler's CAGE (Commercial and Government Entity), and date of manufacture. The assembly marking shall be produced by the use of a nonconductive, fungistatic ink, or paint applied to the printed wiring board, or to a label which is applied to the printed wiring board, or by mechanical pencil marking, mechanical machining, or laser machining on a metallic area provided for marking purposes. All marking shall be able to withstand solder fluxes, cleaning solutions, and molten solder encountered in the assembly of printed boards, shall remain legible after all tests, and in no manner affect the performance of the completed assembly.

* N.3.1.4 Marking of printed boards and assemblies to identify lead (Pb), lead-free (Pb-free) and other attributes.

Suppliers whose customers require marking or labeling of the printed board or assembly to indicate the materials used in the manufacturing of assemblies shall utilize the material category codes identified in J-STD-609 . The material category code categories identified in J-STD-609 cover the following: the printed board base material, the surface finish of the printed board, the solder paste/solder used on an assembly; and the conformal coating used on an assembly. If the printed board of the assembly was marked with the category codes for solders and/or conformal coating and during the manufacturing of the assembly, the materials used do not match those codes, then the completed assembly shall be remarked using the correct material category codes.

* N.3.1.4.1 Marking sequence. The sequence of marking, when required, shall be as follows:

a. The base material used and when applicable, if the base material is halogen-free. b. The printed board surface finish.

c. The reflow, wave, and other solders used to attach components.

d. The conformal coating (if applicable).