MIL-PRF-15733J
THE INSTITUTE FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS INC. (IPC)
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Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed
Solid Solders for Electronic Soldering Applications.
(Copies of this document can be ordered online at www.ipc.org or from the Institute for Interconnecting and
Packaging Electronic Circuits (IPC, INC.), 2215 Sanders Road, Suite 200 South, Northbrook, IL 60062.)
SOCIETY OF AUTOMOTIVE ENGINEERS (SAE)
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Plating, Copper. (DoD adopted)
(Copies of this document may be ordered online at www.sae.org or from Society of Automotive Engineers, 400
Commonwealth Drive, Warrendale, PA 15096-0001.)
(Non-Government standards and other publications are normally available from the organizations that prepare or
distribute the documents. These documents also may be available in or through libraries or other informational
services.)
2.4 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the
text of this document and the references cited herein (except for related associated specifications, specification
sheets, or MS sheets), the text of this document takes precedence. Nothing in this document, however, supersedes
applicable laws and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Specification sheets. The individual item requirements shall be as specified herein and in accordance with the
applicable specification sheet. In the event of any conflict between the requirements of this specification and the
specification sheet, the latter shall govern.
3.2 Qualification. Filters furnished under this specification shall be products which are qualified for listing on the
3.3 Material (see 4.6.1). When a definite material is not specified, a material shall be used which will enable the
filters to meet the performance requirements of this specification. Acceptance or approval of any constituent material
shall not be construed as a guaranty of the acceptance of the finished product.
3.3.1 Impregnating and potting compounds. Compounds used in the impregnating and potting of filters shall be
chemically inactive with respect to the filter unit and the case (see 3.4.1). The compound, either in the state of
original application or as a result of having aged, shall have no adverse effect on the performance of the filter. For
oil-filled filters, the same material shall be used for impregnating as is used for filling. The use of wax is prohibited in
those filters qualified and supplied to the MIL-PRF-15733 specification sheets.
3.3.2 Pure tin prohibition. The use of pure tin is prohibited as an undercoat and final finish both internally and
externally to the filter body and on all associated mounting hardware. The tin content of filter components, associated
mounting hardware, and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3
percent lead, by mass (see 6.5). Lead-free tin alloy high temperature solders may be used where high temperature
solder is necessary, with approval by the qualifying activity. The tin content of lead-free high temperature solders
shall not exceed 97 percent, by mass.
3.4 Interface and physical dimensions. Filters shall meet the interface and physical dimensions specified
(see 3.1).
3.4.1 Performance. Filter performance shall be such that none of the components of the filter are overstressed
during operation as electrically and mechanically specified herein. No degradation, unless allowed for herein, shall
occur during any inspection specified herein. The filter shall meet the specified electrical characteristics at all
operating temperatures, voltages, currents, or any combinations thereof as specified herein.
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