MIL-PRF-28861D
3.5.4 Solder dip (retinning) leads. The manufacturer (or authorized category B or C distributor) may solder
dip/retin the leads of product supplied to this specification provided the solder dip/retin process has been approved by
the qualifying activity (see appendix A).
3.5.5 Threaded parts. Unless otherwise specified (see 3.1), all threaded parts shall be in accordance with
3.5.6 Inductive elements. Unless otherwise specified, the wire used when winding inductors shall have a
minimum diameter of .004 inch (0.10 mm) and shall be capable of meeting the requirements of MW-16, MW-20, MW-
35, or MW-36 of MW-1000, or equivalent. Inductors shall be inspected to ensure that the wire is not kinked or nicked
and that the insulation is continuous. For class S filters only, cores and ferrite beads shall be 100 percent inspected
for chipped coating, cracks, chips, and material cracks and chips (see 4.6.1.2b).
3.5.7 Capacitor elements.
3.5.7.1 Class B filters. Capacitor elements used in class B filters shall meet the requirements of MIL-PRF-31033
for class B except that qualification, group A, and group B inspections are not required. An outside capacitor
manufacturer with existing MIL-STD-790 approval may supply discoidal capacitors for use in MIL-PRF-28861 filters,
provided that manufacturer's discoidal capacitor line is audited and certified by the qualifying activity to the MIL-STD-
790 requirements. Required inspections are as follows:
a. In-process inspection.
b. Destructive physical analysis. Capacitors shall be examined as specified in MIL-PRF-31033.
3.5.7.2 Class S filters. Capacitor elements used in class S filters shall meet the requirements of MIL-PRF-31033
for class S except for qualification inspection. An outside capacitor manufacturer with existing MIL-STD-790 approval
may supply discoidal capacitors for use in MIL-PRF-28861 filters, provided that manufacturer's discoidal capacitor line
is audited and certified by the qualifying activity to the MIL-STD-790 requirements. Required inspections are as
follows:
a. In-process inspection.
b. Inspection of product for delivery (group A and group B inspections) except that the group B life test is not
required.
3.5.8 Solders. When solders are used in filters covered by this specification, the solder joint where the internal
wire exits through a glass seal on all filters and all solder joints on the solder-in style filters shall be made with solder
in accordance with J-STD-006, or equivalent, having a liquid point not less than 280°C or as specified (see 3.1). The
use of lead-free, tin alloy high temperature solders requires approval by the qualifying activity. The tin content of
lead-free high temperature solders shall not exceed 97 percent by mass. For further information and guidance on
soldering filters, see 6.4.3.
3.5.9 Potting (when applicable). When potting compound is used to secure the inductive elements, the inductive
elements shall be potted to at least 80 percent of their height so that the potting makes intimate contact with the case.
3.5.10 Weight (when applicable). Filters shall meet the weight requirements specified (see 3.1).
3.6 Visual inspection (class S filters only). Filters shall be inspected for anomalies as specified in 4.6.1.2.
3.7 Thermal shock and voltage conditioning. When filters are tested as specified in 4.6.2, they shall meet the
following requirements:
Insulation resistance (+125°C): Shall meet initial requirements (see 3.1) and, for class S broadband style
filters (MIL-PRF-28861/1 through MIL-PRF-28861/5), shall decrease no more than 50 percent from pre-voltage
conditioning measurement.
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